Showing all 5 results
Higher density, heat, and more materials make it harder to ensure reliability.
Not all chiplets are interchangeable, and options will be limited.
Applied Materials’ $4B facility at risk; AI chip bonanza; Japan, U.S. alliance; Rapidus’ U.S. subsidiary; EDA revenue up; TSMC $6.6B funding; Infineon, Amkor team up; S. Korea’s big bet; Apple’s processor overhaul; high-NA EUVL defect system; chiplet HW security module; new Spectre attack.
Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.
System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.